Nex GenPower's Quality Control Process and Flowchart

I. General Principles for Quality Control Activities

Nexgenpower's Quality Control (QC) system is built on the principles of "full staff involvement, end-to-end process management, and comprehensive coverage," focusing specifically on GaN (gallium nitride) power adapters across multiple power ratings (30W/45W/65W/100W/140W). It spans the entire lifecycle from raw material intake to product delivery, strictly adhering to global safety standards (including CCC, CE, and UL) as well as Nexgen's internal quality control framework. The core objectives are to ensure stable product quality, compliance with performance specifications and safety requirements, prevent substandard products from entering the market, safeguard brand reputation, achieve a consistent mass production yield of ≥98%, and maintain a customer complaint rate below 0.5%.

Core Principles: Prevention first, combining prevention with control; prioritize key quality aspects such as GaN device performance, electrical safety, and thermal management; establish a closed-loop quality control system featuring "preventive measures before production, in-process monitoring, and post-production traceability" to ensure every product meets both R&D specifications and market requirements.

II. Comprehensive Quality Control Process (7 Key Stages, Including Control Points + Implementation Standards + Deliverables)

Phase 1: Quality Pre-control (Preventive Measures | Before Production)

Core objective: To preemptively mitigate quality risks, ensuring that materials, equipment, personnel, and processes meet quality requirements prior to production, thereby controlling quality at the source.

• Control Node 1: Supply Quality Audit (SQE) – Conduct qualification reviews for suppliers of core components such as GaN chips, transformers, and capacitors; verify their production credentials, safety certifications, and quality control capabilities; maintain a list of qualified suppliers; and perform quarterly re-evaluations.

• Control Node 2: Pre-production Preparation Review   1. Review the product specifications, mass production BOM list, and process cards delivered by the R&D team to confirm that process parameters and quality standards are clearly defined; verify calibration records for production equipment (surface mount machines, soldering machines, testing devices) to ensure proper accuracy; examine training records for production personnel to ensure they adhere to quality operation protocols.

• Implementation Requirements: Suppliers shall provide component qualification certificates and safety compliance certification reports; equipment calibration error must be ≤±0.5%; personnel training and assessment pass rate must reach 100%.

• Deliverables: Product Quality Audit Report, List of Qualified Suppliers, Equipment Calibration Records, Personnel Training and Assessment Reports, Pre-production Quality Audit Form.

Phase 2: Quality Control of Raw Materials Upon Arrival (IQC | Core of Pre-control Measures)

Core objective: Prevent the entry of substandard raw materials, ensure quality at the production source, and avoid potential risks in subsequent production caused by material issues.

• Control Node 1: Material Reception Verification – Verify the specifications, batch numbers, and quantities of incoming materials against the mass production BOM list and purchase orders; confirm the integrity of material packaging and clarity of labeling.

• Control Node 2: Comprehensive Inspection 1 – Perform graded inspection of materials according to specified criteria: Core components (GaN chips, MOSFETs) require 100% full inspection (appearance, electrical performance, safety compliance); conventional materials (PCBs, capacitors, enclosures) require a sampling rate ≥15% (appearance, dimensions, specifications); special materials (heat dissipation components) require a sampling rate ≥20%.

• Control Node 3: Handling Nonconforming Materials – Upon identifying nonconforming materials, immediately isolate and label them, issue a nonconformity report, return them to the supplier with requirements for rectification or replacement, and update the supplier's quality record accordingly.

• Performance Requirements: Electrical performance deviation of GaN chips ≤ ±1%; no surface damage or pin oxidation; PCB board free from deformation and wiring short circuits; plastic housing free from scratches with dimensional deviation ≤ ±0.1 mm.

• Deliverables: Raw material incoming inspection report (IQC report), non-conforming material handling records, material inspection ledger, and material isolation labeling records.

Phase 3: Quality Control in the Production Process (IPQC | Core of In-process Management)

Core Objective: To monitor all stages of the production process in real time, promptly identify and rectify quality defects, ensure compliance with quality standards throughout production, and prevent the generation of defective batches.

• Control Node 1: PCB Assembly Quality Control – Conduct hourly inspections of soldering processes (solder coverage integrity, absence of poor or false solder joints) and component placement accuracy (correct polarity, no misalignment), with each inspection covering ≥20 samples.

• Control Node 2: Structural Assembly Inspection – Inspect the shell's injection molding quality (no burrs or shrinkage marks) and assembly accuracy (no loose pins, properly installed heat dissipation components, tight shell fit); perform inspections every half hour.

• Control Node 3: Firmware Burning Management   1. Verify the firmware version and parameter settings; conduct random inspections of the functional integrity of burned products to ensure proper fast-charging protocols and temperature control logic, with a sampling rate ≥10%.

• Control Node 4: When quality issues (e.g., welding defects or assembly deviations) are identified during production, immediately halt operations, notify the production and R&D teams to analyze causes, develop corrective actions, conduct re-inspection after rectification, resume production only upon passing inspection, and maintain proper incident handling records.

• Execution standards: Welding pass rate ≥ 99.5%; assembly deviation ≤ ±0.2 mm; firmware burning pass rate 100%; closed-loop correction rate 100%.

• Deliverables: Process Inspection Report (IPQC Report), Quality Handling Records, Inspection Logbook, and Rectification Verification Report.

Phase 4: Comprehensive Quality Testing of Final Products (FQC | Core of Final Product Control)

Core objective: Conduct comprehensive testing on all finished products to ensure that their performance, safety, and appearance fully comply with standards; identify non-conforming products and prevent their entry into the market.

• Control Node 1: Electrical Performance Test 1 – Conduct comprehensive testing of final product output voltage/current, ripple, efficiency, and power factor to ensure compliance with specifications (e.g., full-load efficiency ≥ 92%, standby power consumption <0.075 W).

• Control Node 2: Safety Performance Test 1 – Comprehensive verification of overvoltage, overcurrent, overheating, and short-circuit protection functions; testing of insulation resistance and voltage withstand performance, compliant with global safety standards; focused evaluation of GaN device operational stability and heat dissipation performance (housing temperature ≤60°C under full-load operation).

• Control Node 3: Appearance and Function Testing   1. Comprehensive inspection of finished products' appearance (no scratches, clear screen printing, no deformation of pins); random sampling for fast-charging protocol compatibility (compatibility with smartphones, laptops, and other devices) and indicator light functionality, with a sampling ratio ≥15%.

• Control Node 4: Handling Nonconforming Products   1. Isolate and label nonconforming products, identify defect types, analyze causes (e.g., design flaws or manufacturing issues), develop corrective actions, retest after rectification; nonconforming items are strictly prohibited from being stored.

• Implementation Standards: 100% compliance rate for electrical performance; safety performance meeting CCC/CE/UL standards; appearance qualification rate ≥99.8%; 100% protocol compatibility.

• Deliverables: Final Product Inspection Report (FQC Report), Nonconforming Product Handling Records, Final Product Testing Logbook, Functional Compatibility Test Report.

Phase 5: Product Aging and Reliability Verification (QA | Core of Quality Assurance)

Core Objective: Through long-term aging and reliability testing, verify the product's operational stability over extended periods, identify potential quality issues, and ensure it meets the required service life standards.

• Control Node 1: Aging Test 1 – Place FQC-compliant finished products into an aging chamber and subject them to full-load constant-temperature aging for 4 hours (temperature: 45°C ± 5°C) to simulate long-term usage conditions, while recording the product's operational status (no overheating or malfunctions).

• Control Node 2: Reliability Test 1 – Conduct life tests on sampled finished products after aging (≥50,000 hours), high/low temperature cycling tests (-20°C to 60°C), and vibration/impact tests to verify product durability; at least 5 units per batch shall be inspected.

• Control Node 3: Quality Review Phase I – Collect aging and reliability test data, compare them against quality standards, identify potential issues (e.g., inadequate heat dissipation, rapid component degradation), and provide feedback to R&D and production teams to optimize product design and manufacturing processes.

• Performance standards: 100% aging compliance rate; no failures during high-low temperature cycling tests; 100% lifespan achievement rate; 100% closed-loop resolution rate for potential hazards.

• Deliverables: Aging test report, reliability test report, quality review report, and hazard mitigation plan.

Phase 6: Quality Control for Finished Product Storage and Outbound Delivery (Storage Management)

Core objective: Ensure that all finished products stored in inventory are in perfect condition; guarantee that outbound products precisely meet order requirements; and prevent non-compliant products from entering inventory, as well as avoid errors in shipment or omissions.

• Control Node 1: Warehouse Inspection – Verify the batch number, quantity, and inspection report of incoming finished products; conduct random inspections on product appearance and packaging integrity with a sampling rate ≥5%; only products passing inspection may be warehoused; maintain a quality record ledger for incoming goods.

• Control Node 2: Warehouse Management   1. Ready-made products shall be stored by batch and specification, maintaining a dry warehouse environment with constant temperature (15°C–30°C) to prevent moisture absorption or damage; conduct regular inspections of inventory to identify any defects in appearance or packaging integrity.

• Control Node 3: Outbound Inspection 1 – Verify the specifications, quantity, and batch numbers of outbound finished products according to order requirements; conduct random inspections of product appearance and certification documents to ensure compliance with orders, with no defective items, incorrect shipments, or missed deliveries.

• Implementation Standards: 100% pass rate for in-stock sampling inspections; 100% integrity rate of finished products in inventory; 0% error or omission rate for outbound shipments.

• Deliverables: Inventory inspection records, warehouse inspection logs, outbound inspection records, and finished product outbound records.

Stage 7: Post-sales Quality Traceability and Continuous Improvement (Post-event Optimization)

Core Objective: Collect post-sale quality feedback, identify root causes of issues, optimize quality control processes, and continuously enhance product quality.

• Control Node 1: After-sales Feedback Collection – Collect customer complaints and fault reports, recording fault types (e.g., frequent charging issues, casing damage, poor heat dissipation), product batch numbers, and number of faults.

• Control Node 2: Quality Traceability – Based on the faulty product batch, trace the raw material sources, production process records, and inspection data to identify the root cause (e.g., substandard materials, process deviations, or missed tests).

• Control Node 3: Continuous Improvement – Develop corrective actions targeting the root causes of issues (e.g., optimizing suppliers, adjusting production processes, refining inspection standards), implement them, and verify their effectiveness; compile quarterly after-sales quality data, refine quality control procedures, and prepare a quality improvement report.

• Implementation standards: 100% after-sales fault traceability rate; 100% implementation rate of corrective actions; recurrence rate of similar faults ≤0.1%.

• Deliverables: After-sales quality feedback log, quality traceability report, corrective action plan, and continuous quality improvement report.

III. Quality Control Workflow Diagram (Clear, Intuitive, and Practical for Implementation)

Flowchart description: Centered on a closed-loop management framework covering "pre-event, during-event, and post-event phases," this diagram identifies key control points and standard workflows for each stage, clarifies responsibilities of QC, IPQC, FQC, and QA, and is ideal for quality team training and daily operational implementation.

IV. Core Requirements and Precautions for Quality Control

• Quality control personnel must be certified and thoroughly familiar with the quality standards and safety regulations for GaN power adapters. Quarterly training sessions and assessments shall be conducted to ensure professional competence in quality management.

• All inspection, patrol, and test data must be fully documented to ensure traceability; inspection reports shall be signed for confirmation. False records or omissions are strictly prohibited.

• Testing of sensitive components such as GaN chips must be conducted in an anti-static environment, and testing equipment should be regularly calibrated to ensure measurement accuracy.

• For quality issues you frequently handle, follow the "identify-isolate-analyze-correct-verify" process, ensuring a closed-loop resolution within 24 hours to prevent the escalation of batch-related risks.

• Strictly implement sampling inspection standards; it is strictly prohibited to reduce the sampling ratio or omit any testing items. Nonconforming products must not proceed to subsequent stages, be stored in inventory, or be delivered.

• Conduct regular quality reviews (once per month) to compile quality data across all stages, identify common issues, optimize control processes and manufacturing procedures, and enhance product quality consistency.

• Establish a quality incentive and penalty mechanism: reward personnel who strictly adhere to control standards and promptly identify significant quality risks, while penalizing those who violate procedures or cause quality issues.

V. Supporting Implementation Documents

1. Quality Control Gantt Chart (editable in Excel): Clearly defines key control milestones, responsible parties, and objectives for each phase; can be directly copied and pasted for implementation.

2. Inspection standards and record forms for each stage: including IQC/IPQC/FQC/QA inspection forms, routine processing records, traceability tables, etc., which can be directly used for daily quality control;

3. Quality Control Procedures: Detailed specifications outlining the quality control responsibilities, operational workflows, and testing methods for each position, tailored for quality team training and daily operations;

4. Supply Product Quality Control Manual: Standardizes the supplier audit, re-evaluation, and non-conformity handling procedures to ensure stable raw material quality.